Metallic Components :-

           The growing quantity of wireless power transfer may lead to many practical challenges like electromagnetic compatibility, and thermal aspects. For this, we need electromagnetic shields. But The requirements for slim designs in several modern electronic devices might conflict with the dimensions of the electromagnetic shields.

          In addition to the power losses in the secondary and primary circuits, coils, and magnetics, strange entities such as ferromagnetic or metallic ones in the vicinity of the flux routes can also absorb the radiated power.

          If these materials are placed in the middle of the AC magnetic flux, induced eddy currents will be produced and circulated within the materials, thereby resulting in temperature rise and conduction losses. If the conduction loss is considerable, the subsequent temperature growth in the materials could be a safety concern and a probable factor that leads to system damage or failure. For example, the power wastage of 0.5–1 W in metallic materials such as gold rings, paper clips, coins, and metalized pharmaceutical wrapping can increase the entity temperature above 80 ◦C.

          Other than this there are challenges like a high initial cost for the establishment of the system, also if we make everything wireless then there is the issue of disposal of wire with an existing wired system. Although WPT seems to be challenging it has enormous potential to change the world. That we will see in the next section.

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